skip header   hitachi.com   hitachi.us    Global
Hitachi Global Storage Technologies
 

| Project Main List |

Recording Head/ ADV. Head Processing

  Overview

The Hitachi San Jose Research Center maintains an advanced processing laboratory to develop thin film processing techniques required to create advanced read/write heads as well as special test structures for basic research in magnetic recording to extend areal density and internal data rate of the thin film head. These processing activities are conducted in a 5000 sq. ft. class 10 clean room facility with capabilities for electroplating, fine line photolithography, reactive ion etching, ion milling, chemical-mechanical planarization, thin film metal and insulator depositions, and wet etching. In the past 10 years, this laboratory has developed the processing concepts and fabricated the head structures associated with IBM's MR and GMR demonstrations up to the latest areal densities. Using this facility the advanced processing group was responsible for the fabrication of the industry's first GMR spin valve read sensor and this design was the basis for a head which shipped in a 1997 IBM disk drive.

Currently, advanced photolithographic processes are being developed to create a narrow trackwidth inductive head to support 100 Gbits/in2 . Additionally, the electroplating of high magnetic moment materials for the write head pole to provide adequate field strength to write at this density in a key on going process development. The investigation of novel head structures beyond GMR is a key responsibility at San Jose Research Center, and the fabrication and evaluation of magnetic tunnel valve sensors is one area of investigation. The process design for fabrication of novel write head structures with low inductances is an additional area. The laboratory also supports research into advanced materials by fabrication of test structures to evaluate novel insulator compositions, to evaluate new longitudinal bias schemes, and to evaluate test structures for advanced head designs as required by the recording physics group.
space

The Thin Film Head Structure

A thin film head structure consists of 20 material layers with patterns for each layer defined by photolithography and either additive processing (electroplating, liftoff masking) or subtractive processing (ion milling, wet etching, reactive ion etching, chemical mechanical processing). This figure (2) shows a generic head structure and an actual cross section of a Hitachi thin film head product.
Head Structure
Head image
space

Critical Thin Film Head Features

Two critical features in the thin film head, the width of the read sensor (MRw) and the width of the write pole tip (P2w), determine areal density performance. This figure (4) shows SEM views of these features. The lithography techniques for the MR sensor are comparable to gate requirements in integrated circuits. The lithography processing for the write pole tip can be compared with the interconnect processing strategy in the integrated circuit.
Features
space

Areal Density Environment -- Process Implications

For the last 5 years the areal density of recording head structures has sustained annual increases as high as 100%. From a process perspective this requires that the width of the critical read sensor and write pole tip decrease by 20% to 30% each year. By comparison, integrated circuit dimension decrease at an annual rate of 10% to 12%. This figure (5) shows a historical plot of integrated circuit dimensions and thin film head dimensions over the last 20 years. Projections shows that the dimensional requirements for the thin film head will merge with those of the integrated circuit in the middle of this decade. The Advanced Recording Head Processing Department is developing processing techniques which will sustain the areal density growth through this decade.
Feature Trends
space
| Back to Top | 
space








  Terms of Use | Privacy Policy | Contact Us  © 2009 Hitachi Global Storage Technologies